PCB assembly technology-how to Handle High Current on a PCB Without Using Wide Tracks?
In the process of PCB assembly, we often see some exposed solder pad lines, some of which are very wide. Let's take a look at how electronic engineering is generally handled (article from LinkedIn, if the author needs to be credited, please contact us)
As an electronics engineer, you may face situations where you need to design PCB tracks that handle high current, but using wide tracks might not always be a feasible option. Here are some techniques to increase current handling without resorting to wide traces:
1. Increase Copper Thickness
Thicker copper can carry more current. Standard PCB copper thickness is typically 1 oz/ft² (35 µm), but you can order PCBs with thicker copper layers, such as 2 oz/ft² or even 3 oz/ft², which increases the current-carrying capacity significantly.
2. Use Multiple Layers
Parallel traces on different layers can be used to distribute the current. You can route the same signal on multiple PCB layers (e.g., top and bottom) to share the current load across multiple traces, effectively increasing the current capacity without increasing the width. You can also use vias to connect the traces on different layers and spread the current load. Multiple vias in parallel can help distribute the current more effectively.
3. Add Solder to the Trace
You can tin the trace by applying solder along the entire length of the track. This adds a significant amount of thickness to the copper track and improves current handling. This is often referred to as “solder mask opening,” where you leave parts of the track exposed so that solder can be applied.
4. Use a Copper Bus Bar or Wire
For extremely high_current applications, you can place a copper bus bar or thick wire directly onto the PCB surface, either soldered or mechanically fixed. This carries the current while using the PCB track for connection purposes.
By utilizing these techniques, you can significantly increase your PCB’s current handling capacity without relying on excessively wide traces.